Effect of slurry on Vapor Deposition Polymerization (VDP)Chemical Mechanical Planarization (CMP) in Through-Silicon Via (TSV) Applications

Autor:	Iqbal Ali, Brian Sapp, Roger Quon, Seth Kruger, Kaoru Maekawa, Kippei Sugita, Hiroyuki Hashimoto, Matthias Stender, Jeff Dysard, Sitaram Arkalgud
Rok vydání:	2012
Zdroj:	ECS Meeting Abstracts. :2498-2498
ISSN:	2151-2043
DOI:	10.1149/ma2012-02/29/2498
Popis:	not Available.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8cbabd4fc291b41b991ee5c975880d26 https://doi.org/10.1149/ma2012-02/29/2498 Zobrazit plný text záznamu