Integration of Low Temperature 480℃ SiOCN as Offset Spacer in view of 3D Sequential Integration

Autor:	A. Michallet, C. Bout, J. Fort, T. Skotnicki, V. Beugin, F. Pierre, D. Benoit, L. Brunet, P. Besson, C. Arvet, M.-P. Samson, C. Tabone, N. Rochat, C.-M. V. Lu, V. Loup, Perrine Batude, C. Fenouillet-Beranger, N. Posseme, Bernard Previtali, A. Roule, M Vinet
Rok vydání:	2016
Předmět:	Offset (computer science) Materials science business.industry Optoelectronics business
Zdroj:	Extended Abstracts of the 2016 International Conference on Solid State Devices and Materials.
DOI:	10.7567/ssdm.2016.ps-1-07
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8c6fc04f99aed20c8896bd797c3521be https://doi.org/10.7567/ssdm.2016.ps-1-07 Zobrazit plný text záznamu