Design and Testing of MEMS Metal Bridge Solid State Switch
| Autor: | Liao Maohao, Feng Hengzhen, Wenzhong Lou, Xuran Ding, Zheng Fuquan |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
010302 applied physics
Microelectromechanical systems Materials science Solid-state relay Mechanical engineering 02 engineering and technology 021001 nanoscience & nanotechnology 01 natural sciences Signal Bridge (interpersonal) Controllability Reliability (semiconductor) Hardware_GENERAL 0103 physical sciences Wafer 0210 nano-technology Joule heating |
| Zdroj: | NEMS |
| DOI: | 10.1109/nems.2019.8915643 |
| Popis: | In this paper, a MEMS metal bridge solid-state switch with small size, good consistency, safety and controllability is developed. The MEMS micro-actuator designed a planar structure. There is a metal bridge structure in the device. Due to the characteristics of the metal bridge structure, the high current pulse drive signal tends to generate a large amount of Joule heat at the bridge structure of the device. In order to understand the possible failure conditions of the device, this paper analyzes the effect of such Joule heat inside the device, carries out related theoretical calculations, and uses COMSOL to complete the failure simulation analysis. At the same time, this paper has carried out reliability research on chip manufacturing, packaging and soldering process through wafer level test and device level test, and optimized the structure design. Finally, the processing and packaging of the device MEMS metal bridge solid state switch is realized. |
| Databáze: | OpenAIRE |
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