Reduced Electrical Resistivity of Ternary Solder Alloy of Tin–Copper–Sulfur: An Anti-Oxidative Role of Sulfur in Binary Solder Alloy of Tin–Copper

Autor:	Tae-Soo Lim, Sang Hoon Kim, Dong-Yeol Yang, Sangsun Yang, Yong-Jin Kim
Rok vydání:	2014
Předmět:	Materials science Mechanical Engineering Metallurgy chemistry.chemical_element Condensed Matter Physics Combustion Copper Sulfur chemistry Mechanics of Materials Electrical resistivity and conductivity General Materials Science Anti oxidative Tin Ternary operation Solder alloy
Zdroj:	MATERIALS TRANSACTIONS. 55:1513-1516
ISSN:	1347-5320 1345-9678
DOI:	10.2320/matertrans.m2014102
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8c6da870979bf63cd4c8a5a066c21c57 https://doi.org/10.2320/matertrans.m2014102 Zobrazit plný text záznamu