Fabrication of new micromachined transmission line with dielectric posts for millimeter-wave applications
Autor: | Young-Hoon Chun, Soon-Koo Kim, Byeong-Ok Lim, Tae-Jong Baek, Baek-Seok Ko, Dong-Hoon Shin, Sung-Chan Kim, Hyun-Chang Park, Han-Shin Lee, Jin-Koo Rhee |
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Rok vydání: | 2004 |
Předmět: |
Engineering
business.industry Frequency band Mechanical Engineering Electrical engineering Dielectric Microstrip Electronic Optical and Magnetic Materials Surface micromachining Mechanics of Materials Transmission line Extremely high frequency Optoelectronics Dielectric loss Electrical and Electronic Engineering business Electrical impedance |
Zdroj: | Journal of Micromechanics and Microengineering. 14:746-749 |
ISSN: | 1361-6439 0960-1317 |
Popis: | This paper describes a new GaAs-based surface-micromachined microstrip line supported by dielectric posts and with an air gap between the signal line and the ground metal. This new type of dielectric post and air-gapped microstripline (DAML) structure was developed using surface micromachining techniques to provide an easy means of air-bridge connection between the signal lines and to achieve low losses in the millimeter-wave frequency band with a wide impedance range. Each DAML is fabricated with a length of 5 mm. By elevating the signal lines from the substrate using micromachining technology, the substrate dielectric loss can be reduced. Compared with conventional microstrip transmission lines, which show over 10 dB cm−1 loss, the loss of a DAML can be reduced to 1.1 dB cm−1 at 50 GHz. |
Databáze: | OpenAIRE |
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