Managing Bias-Temperature Instability for Product Reliability
| Autor: | Yung-Huei Lee, W. McMahon, Neal R. Mielke, S. Walstra, Y.-L.R. Lu |
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| Rok vydání: | 2007 |
| Předmět: |
Engineering
Negative-bias temperature instability business.industry Spec# Hardware_PERFORMANCEANDRELIABILITY Integrated circuit design Reliability engineering Reliability (semiconductor) visual_art Product (mathematics) Electronic component Hardware_INTEGRATEDCIRCUITS visual_art.visual_art_medium Electronic engineering Process optimization business computer Hardware_LOGICDESIGN Degradation (telecommunications) computer.programming_language |
| Zdroj: | 2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA). |
| DOI: | 10.1109/vtsa.2007.378916 |
| Popis: | A NBTI model has been generated which takes into consideration AC recovery. This model can be used to improve the connection between the DC stress measurements of a discrete device and AC product usage in a real device. The model can be incorporated into circuit aging simulations to check the NBTI degradation for a simple circuit. For complicated circuitry such as CPU, NBTI degradation should be managed through process optimization, circuit timing design, and product test guardband to ensure that products meet customer spec and lifetime usage. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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