| Autor: |
Ian Bennett, M. Janssen, Ian Richardson, Vera Popovich, Azwar Yunus |
| Rok vydání: |
2010 |
| Předmět: |
|
| Zdroj: |
2010 35th IEEE Photovoltaic Specialists Conference. |
| DOI: |
10.1109/pvsc.2010.5616046 |
| Popis: |
Silicon wafer thickness reduction without increasing the wafer strength leads to a high breakage rate during subsequent handling and processing steps. Cracking of solar cells has become one of the major sources of solar module failure and rejection. Hence, it is important to evaluate the mechanical strength of solar cells and influencing factors. The purpose of this work is to understand the fracture behavior of silicon solar cells and to provide information regarding the bending strength of the cells. Triple junctions, grain size and grain boundaries are considered, to investigate the effect of crystallinity features on silicon wafer strength. Significant changes in fracture strength are found as a result of metallization morphology and crystallinity of silicon solar cells. It is observed that the aluminum paste type influences the strength of the solar cells. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
