Steady state thermal conductivity measurements of AlN and SiC substrate materials

Autor: E.S. Dettmer, B.M. Romenesko, H.K. Charles, B.G. Carkhuff, D.J. Merrill
Rok vydání: 2003
Zdroj: Proceedings., 39th Electronic Components Conference.
DOI: 10.1109/ecc.1989.77804
Databáze: OpenAIRE