Easy Process and Performance Improvement for Top-Emission Organic Light-Emitting Diodes by Using UV Glue as the Insulation Layer on Copper Substrate

Autor:	Yu-Sheng Tsai, Tsung-Eong Hsieh, Shun-Hsi Wang, Shu-Wei Chang, Mark-O Liu, Ming-Hua Chung, Fuh-Shyang Juang, Chen Chuan-Hung, Teh-Chao Liao
Rok vydání:	2010
Předmět:	Materials science business.industry chemistry.chemical_element Surface finish Condensed Matter Physics Luminance Copper Electronic Optical and Magnetic Materials chemistry OLED Surface roughness Optoelectronics Junction temperature Electrical and Electronic Engineering business FOIL method Diode
Zdroj:	Journal of Display Technology. 6:279-283
ISSN:	1551-319X
DOI:	10.1109/jdt.2010.2048300
Popis:	A high heat dissipation material (copper, Cu) was employed as the substrate for top emission organic light-emitting diodes (TEOLEDs). The UV glue was spin-coated onto the Cu substrate as the insulation layer to effectively improve Cu surface roughness and reduce process complexity. From the optoelectronic results, the optimized device with the Cu substrate shows the maximum luminance of 14110 cd/m2 and luminance efficiency of 7.14 cd/A. The surface and junction temperatures are measured to discuss the heat-dissipating effect on device performance. From the results, TEOLED fabricated on a Cu substrate has lower junction (55.34°C) and surface (25.7°C) temperatures, with the lifetime extended seven times. We employed Cu foil as the substrate for flexible TEOLED with maximum luminance of 10310 cd/m2 and luminance efficiency of 7.3 cd/A obtained.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8b7c736695ffe8dc34d73c52eed11e7a https://doi.org/10.1109/jdt.2010.2048300 Zobrazit plný text záznamu