Impact of the Bonding Design Parameters on the Shielding Effectiveness of Board-Level Shields at Microwave frequencies
| Autor: | Pavithrakrishnan Radhakrishnan, Tim Claeys, Johan Catrysse, Davy Pissoort |
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| Rok vydání: | 2022 |
| Zdroj: | 2022 International Symposium on Electromagnetic Compatibility – EMC Europe. |
| DOI: | 10.1109/emceurope51680.2022.9901088 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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