Novel CMP Material Solution To Enable High Removal Rate Dielectric CMP For Hybrid Bonding Application

Autor:	Tapash Chakraborty, Steven Verhaverbeke, Han-Wen Chen, Gopi Chandran
Rok vydání:	2022
Zdroj:	2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
DOI:	10.1109/eptc56328.2022.10013230
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8b024b443c924e257a337ad10cc01824 https://doi.org/10.1109/eptc56328.2022.10013230 Zobrazit plný text záznamu