Copper electroplating technique for development of HTS current leads bottom joints using MgB2 wires

Autor:	Nitin Bairagi, D. Sonara, H. Nimavat, V.L. Tanna, U. Prasad, D. Raju
Rok vydání:	2022
Předmět:	Energy Engineering and Power Technology Electrical and Electronic Engineering Condensed Matter Physics Electronic Optical and Magnetic Materials
Zdroj:	Physica C: Superconductivity and its Applications. 601:1354108
ISSN:	0921-4534
DOI:	10.1016/j.physc.2022.1354108
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8aadb60346b4005d0ceefa8fc08194f5 https://doi.org/10.1016/j.physc.2022.1354108 Zobrazit plný text záznamu Full Text from ScienceDirect