Development of a 3-layer mechanism passive-type assistive suit for lower back and upper arm

Autor:	Chi Lok Wan, Toshifumi Ishioka, Chiaki Kanda, Keisuke Osawa, Kenji Kodama, Eiichiro Tanaka
Rok vydání:	2022
Zdroj:	2022 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM).
DOI:	10.1109/aim52237.2022.9863371
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8a7b94f4938c4a3135cfd73fd5956947 https://doi.org/10.1109/aim52237.2022.9863371 Zobrazit plný text záznamu