Insights into Scaled Logic Devices Connected from Both Wafer Sides

Autor:	A. Veloso, G. Eneman, P. Matagne, B. Vermeersch, A. Jourdain, H. Arimura, B. O'Sullivan, R. Chen, A. De Keersgieter, E. Simoen, D. Radisic, Y. Oniki, A. Laffitte, S. Brus, E. Beyne, E. Dentoni Litta, N. Horiguchi
Rok vydání:	2022
Zdroj:	2022 International Electron Devices Meeting (IEDM).
DOI:	10.1109/iedm45625.2022.10019521
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8a79086230a5230b81cef74e3d9866df https://doi.org/10.1109/iedm45625.2022.10019521 Zobrazit plný text záznamu