Autor:	Masataka Hoshino
Rok vydání:	2001
Předmět:	Die preparation Materials science Wafer thinning business.industry Electrode General Engineering Electronic engineering Optoelectronics Wafer testing Wafer Thermal management of electronic devices and systems business Wafer backgrinding
Zdroj:	Journal of the Surface Finishing Society of Japan. 52:479-483
ISSN:	1884-3409 0915-1869
DOI:	10.4139/sfj.52.479
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8a3108b3bfba2e57c9e4308295834e3e https://doi.org/10.4139/sfj.52.479 Zobrazit plný text záznamu