Engineered Solder-Directed Self-Assembly Across Length Scales

Autor: Shameek Bose, Robert J. Knuesel, Heiko O. Jacobs, Wei Zheng
Rok vydání: 2007
Předmět:
Zdroj: MRS Proceedings. 990
ISSN: 1946-4274
0272-9172
DOI: 10.1557/proc-0990-b05-03
Popis: We report on recent progress in the directed self-assembly of discrete inorganic semiconductor device components. Different from prior research, the goal is to enable the integration of increasingly small dies while supporting unique-angle orientation and contact pad registration. The process is based on the reduction of surface free energy between liquid solder coated areas on the substrate and metal-coated binding sites on the semiconductor dies. Recent advances include flip-chip assembly with unique angular orientation accomplished using “two-element” docking sites that contain pedestals that act as chaperones for the solder directed assembly to take place. The scale reduction to 20 μm sized components involves the use of a liquid-liquid interface to concentrate component delivery and speed up the self-assembly process to prevent oxidative dissolution of the solder sites prior to completion.
Databáze: OpenAIRE
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