Impact of Ti Deposition Condition and Subsequent RTA on Contact Resistance of W-Bit Line in sub-micron technology DRAM

Autor: Young-Woo Kweon, Dae-Young Park, Ilgweon Kim, Tae-Seok Kwon, Tae-Un Youn, Se-Kyeong Choi, Nam-Sung Kim, Soo-ik Jang, Joo-Seog Park
Rok vydání: 2002
Předmět:
Zdroj: Extended Abstracts of the 2002 International Conference on Solid State Devices and Materials.
DOI: 10.7567/ssdm.2002.p3-10
Databáze: OpenAIRE