Physical Model for Power Supply Noise and Chip/Package Co-Design in Gigascale Systems with the Consideration of Hot Spots

Autor:	D.C. Sekar, Gang Huang, K. Shakeri, Azad Naeemi, James D. Meindl
Rok vydání:	2007
Předmět:	Noise temperature Engineering Noise generator Switched-mode power supply business.industry Power module Electronic engineering Electrical engineering Effective input noise temperature Flicker noise Power factor business Power network design
Zdroj:	CICC
DOI:	10.1109/cicc.2007.4405859
Popis:	An analytical physical model is derived for the first time to predict the first droop power supply noise for non-uniform current switching conditions and arbitrary functional block sizes. The model not only captures the impact of package parameters and the distributed nature of power grid and decoupling capacitance but also addresses the non-uniformity problem for the power density distribution brought by hot spots. A case study shows that both the frequency domain power noise model and the projected peak noise value have less than 1% error comparing with SPICE simulation.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::88da27caa0658cf9a21a7acb31e6c10e https://doi.org/10.1109/cicc.2007.4405859 Zobrazit plný text záznamu