Panel Level Packaging – Where are the Technology Limits?

Autor:	Tanja Braun, Ole Holck, Mattis Obst, Steve Voges, Ruben Kahle, Lars Bottcher, Mathilde Billaud, Lutz Stobbe, Karl-Friedrich Becker, Rolf Aschenbrenner, Marcus Voitel, Friedrich-Leonhard Schein, Lutz Gerholt, Martin Schneider-Ramelow
Rok vydání:	2022
Zdroj:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::887a6880363d374ec8b9f1a684099501 https://doi.org/10.1109/ectc51906.2022.00133 Zobrazit plný text záznamu