Low Sintering Temperature of CuO-Fluxed Ag(Nb, Ta)O3 Dielectric Ceramics

Autor:	Chiping Wang, Michael T. Lanagan, Thomas R. Shrout, Hyo Tae Kim, G. Y. Yang, Do-Kyun Kwon
Rok vydání:	2003
Předmět:	Materials science visual_art visual_art.visual_art_medium Analytical chemistry Sintering Grain boundary Ceramic Dielectric Microstructure Temperature coefficient High-κ dielectric Solid solution
Zdroj:	MRS Proceedings. 783
ISSN:	1946-4274 0272-9172
DOI:	10.1557/proc-783-b1.3
Popis:	Solid solutions in the Ag(NbxTa1−x)O3 (where 0 ≤ × ≤ 1) system exhibit excellent dielectric properties at microwave frequency including high dielectric constant (2000.65Ta0.35)O3+55wt% Ag(Nb0.35Ta0.65)O3) yielded an average dielectric constant of 450 and a TCC of 180ppm/°C. Microstructure analysis revealed that a CuO-rich liquid remains at the grain boundary and transmission electron microscopy shows that the CuO resides at triple points. Ag(NbxTa1−x)O3 ceramics were successfully integrated into LTCC for embedded capacitors. The addition of CuO lowered the sintering temperature to below 900°C and a low TCC was maintained for fine grained microstructures.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::87cd16f10eb99eccdd715f97d32ff609 https://doi.org/10.1557/proc-783-b1.3 Zobrazit plný text záznamu Full text from SpringerLink