Comparative study of Cl2 + O2 and HBr + O2 plasma chemistries in respect to silicon reactive-ion etching process
| Autor: | Alexander Efremov, Nomin Lim, Kwang-Ho Kwon |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
010302 applied physics
Chemistry Plasma parameters Kinetics Analytical chemistry 02 engineering and technology 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Dissociation (chemistry) Surfaces Coatings and Films Etching (microfabrication) Yield (chemistry) 0103 physical sciences Halogen Atom Reactive-ion etching 0210 nano-technology Instrumentation |
| Zdroj: | Vacuum. 186:110043 |
| ISSN: | 0042-207X |
| DOI: | 10.1016/j.vacuum.2020.110043 |
| Popis: | The comparative study of Cl2 + O2 and HBr + O2 plasma chemistries in respect to Si reactive-ion etching process was carried out. Both plasma diagnostics and modeling tools were applied to compare effects of gas mixing ratios on steady-state plasma parameters and densities of active species as well as to determine key processes in respect to Cl and Br atom kinetics. It was found that a) the variation of Cl2/O2 and HBr/O2 mixing ratios produces opposite changes in both electrons-related and ions-related plasma parameters in corresponding gas systems; b) the stepwise dissociation pathways, such as Cl2 + O/O(1D) → ClO + Cl and HBr + O/O(1D) → OH + Br, have no principal influence on the halogen atom formation rates; and c) the higher formation rate and the lower recombination frequency for Cl atoms always provide the condition [Cl] > [Br]. The data on fluxes of plasma active species provided the analysis of Si etching kinetics in terms of process-condition-dependent reaction probability and etching yield. It was suggested that both parameters are sensitive to O atom flux through the oxidation of reaction products into the lower volatile SiClxOy and SiBrxOy compounds. |
| Databáze: | OpenAIRE |
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