| Autor: |
Young Mo Lee, Young-Tae Kwon, Yoonyoung Bae, Seong-Wook Choi, Sang-Don Lee, Yeo Yong Woon, Yong Ho Kwon, Young June Park, Eung Ju Lee, Nam Chul Kim, Jong Heon Kim, Yoon Mook Park, Jun Kyu Lee |
| Rok vydání: |
2018 |
| Předmět: |
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| Zdroj: |
2018 IEEE 68th Electronic Components and Technology Conference (ECTC). |
| DOI: |
10.1109/ectc.2018.00184 |
| Popis: |
Fan Out Wafer Level Package (FOWLP) and Panel Level Package (PLP) have been introduced as cost-performance-form factor alternatives conventional packages. This paper shows the enhanced features and performance of FOWLP for high frequency automotive ADAS applications, fingerprint sensors and medical applications. Small form factor ( |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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