Indium thermal interface material development for microprocessors
| Autor: | Raj N. Master, Mohammad Khan, Sean S. Too, Kee-Hean Keok, Jacquana Diep, Maxat Touzelbaev |
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| Rok vydání: | 2009 |
| Předmět: |
inorganic chemicals
Materials science Silicon digestive oral and skin physiology Metallurgy chemistry.chemical_element Thermal grease Direct bonding respiratory system eye diseases Highly accelerated stress test Corrosion chemistry Soldering visual_art Electronic component visual_art.visual_art_medium sense organs Composite material Indium |
| Zdroj: | 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium. |
| DOI: | 10.1109/stherm.2009.4810762 |
| Popis: | Optimal thermal design of high-power electronic components often requires use of solder-type thermal interface materials. Pure indium solder provides best combination of mechanical and thermo-mechanical properties for efficient thermal design. Two indium TIM assembly approaches were investigated: pre-attach approach and preform approach. Pre-attach refers to bonding indium to the lid cavity first, prior to microprocessor lid attach. Preform refers to direct bonding of indium to lid and silicon in a single reflow process. In the pre-attach approach, indium preform is attached to nickel-plated lid without gold metallization with aggressive flux. This type of flux must be cleaned thoroughly prior to microprocessor lid attach to avoid corrosion. After reflow, indium takes the shape of a dome in the lid cavity. This dome-shape indium can cause lid tilt reject during lid attach. Therefore, a follow-up coining step is required to flatten the indium dome prior to lid attach. |
| Databáze: | OpenAIRE |
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