Effect of metal buffer layer on the thermal interface performance of liquid metal alloy on copper plate

Autor: Huilong Yan, Jinliang Yan, Yulong Ji
Rok vydání: 2019
Předmět:
Zdroj: Journal of Materials Science: Materials in Electronics. 30:15766-15771
ISSN: 1573-482X
0957-4522
DOI: 10.1007/s10854-019-01962-1
Popis: Liquid metal alloy (LMA) used as thermal interface material (TIM) has been considered as a prospective way to solve the problem of contact heat transfer with high heat flux. In order to investigate the LMA wettability effect on the contact heat transfer, metal buffer layers of silver (Ag), nickel (Ni), molybdenum (Mo), and tungsten (W) were deposited on copper plates by DC magnetron sputtering. Then, samples were fabricated by using LMA of Ga62.5In21.5Sn16 to sandwich the copper plates together. The laser flash analysis method was used to investigate thermal diffusivity, thermal conductivity and thermal contact resistance (TCR) of the sandwiched structure samples. Results reveal that thermal properties are related to the surface free energy (SFE) of buffer layer materials. With the increase of SFE, TCR decreases, and the thermal diffusivity and thermal conductivity increase. The sample with a W buffer layer exhibits TCR as low as 0.402 mm2 K/W and a thermal conductivity of 378.261 W/mK. Compared with samples without buffer layers, TCR can be decreased by about 64.05%. The buffer layer in the interface region plays a critical role in modulating the contact heat transfer.
Databáze: OpenAIRE
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