Radiation emission for parallel planes with vias in packaging
| Autor: | Hongxing Zheng, Panpan Zuo, Erping Li, Yan Li, Yanbo Xu, Wen-Yuan Cao |
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| Rok vydání: | 2017 |
| Předmět: |
Partial element equivalent circuit
Model method Key factors Radiation emission Materials science Simple (abstract algebra) Acoustics Electric field 0202 electrical engineering electronic engineering information engineering 020206 networking & telecommunications 02 engineering and technology Numerical models Dielectric |
| Zdroj: | 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS). |
| DOI: | 10.1109/edaps.2017.8276924 |
| Popis: | To investigate the radiation emission of a simple package model, the partial element equivalent circuit (PEEC) method combines with the field-equivalence principle is proposed in this paper. Simulation results using the proposed method and the cavity model method are compared with each other and show a good agreement. Some key factors of the structure are simulated as well to obtain the corresponding effect on the radiated electric field which helps to provide design guidance. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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