Effect of bonding temperature on microstructure and shear strength of the dissimilar Al/Al-27Si joints bonded by partial transient liquid phase bonding

Autor: Weicai Wan, Lei Xu, Qingzhu Sun, Haibo Wang, Hongsheng Chen
Rok vydání: 2019
Předmět:
Zdroj: Journal of Manufacturing Processes. 41:297-306
ISSN: 1526-6125
DOI: 10.1016/j.jmapro.2019.04.004
Popis: The microstructure and shear strength of the Al alloy/Al-27Si alloy (Al/Al-27Si) joints with Cu interlayer bonded at different temperatures were investigated in the present study. Results show that a soldering seam with many eutectic phases is obtained in the Al/Al-27Si joints. These eutectic phases are mainly composed of θ-CuAl2 phase, α-Al phase and Si phase. With the increase of bonding temperature, the width of soldering seam and the average size of Si particles gradually increase, while the density of eutectic θ-CuAl2 phase deceases. The morphologies of Si phases transform from the granular particles into the needle-like shape when the temperature increases to 560 °C. The penetration of eutectic phases into the Al matrix along the grain boundaries is generated and the non-planar Al/soldering-seam interfaces are developed. With the increase of bonding temperature, the shear strengths of Al/Al-27Si joints firstly increase because of the better joining effect and less micro-cracks, and then decrease resulting from the morphology transformation of Si phases. The maximum shear strength of 70.4 MPa is achieved at 550 °C.
Databáze: OpenAIRE
Externí odkaz: