Flip chip interconnect of 2.5-watt CPW power amplifier MMIC

Autor:	C. Liu, W.D. Gray, C.P. Wen, W.S. Wong, D.C. Wang, C.K. Pao
Rok vydání:	2002
Předmět:	Watt Power-added efficiency Materials science business.industry Amplifier Coplanar waveguide Electrical engineering Integrated circuit design Power (physics) Hardware_GENERAL Hardware_INTEGRATEDCIRCUITS Integrated circuit packaging business Monolithic microwave integrated circuit
Zdroj:	Proceedings of IEEE Electrical Performance of Electronic Packaging.
DOI:	10.1109/epep.1993.394598
Popis:	A monolithic X-band coplanar waveguide power amplifier utilizing high yield flip chip interconnect technology has been designed and fabricated. A peak power of 2.5 watts with a power added efficiency better than 24% at 8 GHz has been achieved. >
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::86879d88e144f3586a2780f2ba6b9124 https://doi.org/10.1109/epep.1993.394598 Zobrazit plný text záznamu