Effect of surface treatment on adhesion strength between magnetron sputtered copper thin films and alumina substrate

Autor:	Kam Chew Leong, Zhong Chen, Pui Mun Lee, Daniel Min Woo Rhee, Ju Dy Lim
Rok vydání:	2015
Předmět:	Materials science Plasma cleaning Metallurgy General Physics and Astronomy Surfaces and Interfaces General Chemistry Adhesion Substrate (electronics) Condensed Matter Physics Surface energy Surfaces Coatings and Films Contact angle Sputtering Surface roughness Thin film Composite material
Zdroj:	Applied Surface Science. 355:509-515
ISSN:	0169-4332
DOI:	10.1016/j.apsusc.2015.07.141
Popis:	A number of surface pre-treatments have been studied for their effectiveness on the adhesion strength between magnetron sputtered copper (Cu) thin film and polycrystalline alumina (Al2O3) substrate. The treatments include organic solvent cleaning, acid washing, heat treatment, plasma cleaning, and they were organized into different sequences in order to evaluate their individual contribution to the film adhesion. Adhesion strength was measured mechanically using a pull test. By proper pre-treatment, the adhesive strength of at least 34 MPa can be achieved with direct sputtering of Cu thin film onto the Al2O3 substrate. With the help of XPS, SEM, XRD, TGA and contact angle measurement, the effect of the different substrate surface treatment techniques has been elucidated.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8653dc00603b87830efc3b5e2ad2d3f0 https://doi.org/10.1016/j.apsusc.2015.07.141 Zobrazit plný text záznamu Full Text from ScienceDirect