Modeling of Practical Substrate Thickness in Multilayer Printed Circuit Board for Millimeter-Wave Packaging

Autor:	Dongmin Lee, Ahnwoo Lee, Minchul Kim, Wonseok Choe, Chungsik Lee, Kwansun Yoon, Mingeun Jeong, Junghyun Kim
Rok vydání:	2023
Předmět:	Electrical and Electronic Engineering Industrial and Manufacturing Engineering Electronic Optical and Magnetic Materials
Zdroj:	IEEE Transactions on Components, Packaging and Manufacturing Technology. 13:511-519
ISSN:	2156-3985 2156-3950
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::863884bf8b97ba2c038e7e5f8cdf65bf https://doi.org/10.1109/tcpmt.2023.3267487 Zobrazit plný text záznamu