| Autor: |
Zhaonian Cheng, Wenkai Tao, Lili Zhang, Yulai Gao, Yan Zhang, Qijie Zhai, Johan Liu, Cristina Andersson |
| Rok vydání: |
2008 |
| Předmět: |
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| Zdroj: |
2008 International Conference on Electronic Packaging Technology & High Density Packaging. |
| DOI: |
10.1109/icept.2008.4607057 |
| Popis: |
This paper investigates a composite solders obtained by adding Sn-3.0Ag-0.5Cu (SAC) nano-particles into conventional eutectic Sn-58Bi solder paste. The microstructure analysis and the measurement of the Vickers microhardness have been carried out. Utilizing the self-developed Consumable-electrode Direct Current Arc (CDCA) technique, the Sn-3.0Ag-0.5Cu nano-particles with an average particle size between 20 and 80nm are prepared. The reinforced lead-free Sn-Bi solder was prepared by thoroughly blending the nanometer-sized SAC particles into the eutectic Sn-Bi solder paste. The SAC reinforced Sn-Bi composite solder paste was printed onto ENIG/Cu metalized substrate and reflowed in a conventional reflow oven. After reflow, the morphology of the as-solidified reinforced composite solder was observed by means of SEM and TEM. The Vickers microhardness measurements indicated that the addition of SAC nano-particles enhances the overall strength of the eutectic solder, and the results agree well with the theory of dispersion strengthening. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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