High performance heat curing copper-silver powders filled electrically conductive adhesives

Autor:	Hui-Wang Cui, Jinting Jiu, Hiroshi Uchida, Katsuaki Suganuma, Tohru Sugahara, Shijo Nagao
Rok vydání:	2015
Předmět:	Materials science Reducing agent technology industry and agriculture Vinyl ester Electronic packaging chemistry.chemical_element Dispersant Copper Electronic Optical and Magnetic Materials chemistry Electrical resistivity and conductivity Shear strength Adhesive Composite material
Zdroj:	Electronic Materials Letters. 11:315-322
ISSN:	2093-6788 1738-8090
DOI:	10.1007/s13391-014-4292-2
Popis:	In this study, high performance electrically conductive adhesives were fabricated from a vinyl ester resin, a thermal initiator, silver coated copper powders, and pure silver powders, without using any other coupling agent, dispersing agent, and reducing agent. The heat cured copper-silver powders filled electrically conductive adhesives presented low bulk resistivity (e.g., 4.53 × 10−5 Ω·cm) due to the silver powders that had given high electrical conductivity to the adhesives, and high shear strength (e.g., 16.22 MPa) provided by the crosslinked structures of vinyl ester resin. These high performance copper-silver powders filled electrically conductive adhesives have lower cost than those filled by pure silver powders, which can be well used in the electronic packaging and can enlarge the application prospects of electrically conductive adhesives.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::853ac9e0d9b866674533be8393633479 https://doi.org/10.1007/s13391-014-4292-2 Zobrazit plný text záznamu Full text from SpringerLink