Barrier and seed repair performance of thin RuTa films for Cu interconnects
| Autor: | Virginie Gravey, B. Parmentier, Erik Sleeckx, Nancy Heylen, A. Cockburn, J. Steenbergen, G. Faelens, Thierry Conard, M. Van De Peer, L. Carbonell, Koen Marrant, Zs. Tkei, Gerald Beyer, Henny Volders, Christopher J. Wilson, Kavita Shah, Chao Zhao, Kristof Kellens |
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| Rok vydání: | 2011 |
| Předmět: |
Annealing (metallurgy)
Analytical chemistry Oxide Mineralogy Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials chemistry.chemical_compound chemistry Tantalum nitride Physical vapor deposition Thermal stability Wafer Metallizing Electrical and Electronic Engineering Thin film |
| Zdroj: | Microelectronic Engineering. 88:690-693 |
| ISSN: | 0167-9317 |
| DOI: | 10.1016/j.mee.2010.09.003 |
| Popis: | Thin ( |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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