Temperature Cycling Performance of Bi-doped Solder Ball Alloy on DRAM Module Form and Daisy-Chained Printed Circuit Board
| Autor: | Y. S. Zou, M. H. Chung, C. L. Gan, Jeremy Chen, Claire Hsu, Hem Takiar |
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| Rok vydání: | 2022 |
| Zdroj: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC). |
| DOI: | 10.1109/eptc56328.2022.10013228 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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