Dielectric thermally conductive boron nitride/polyimide composites with outstanding thermal stabilities via in -situ polymerization-electrospinning-hot press method
| Autor: | Yalan Wu, Qiuyu Zhang, Lidong Tian, Junwei Gu, Hua Qiu, Li Wanzheng, Zhaoyuan Lv, Yongqiang Guo |
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| Rok vydání: | 2017 |
| Předmět: |
Materials science
02 engineering and technology Dielectric 010402 general chemistry 021001 nanoscience & nanotechnology 01 natural sciences Electrospinning 0104 chemical sciences chemistry.chemical_compound chemistry Mechanics of Materials Boron nitride Ceramics and Composites Thermal stability Dielectric loss In situ polymerization Composite material 0210 nano-technology Glass transition Polyimide |
| Zdroj: | Composites Part A: Applied Science and Manufacturing. 94:209-216 |
| ISSN: | 1359-835X |
| DOI: | 10.1016/j.compositesa.2016.12.014 |
| Popis: | Micrometer boron nitride/polyamide acid ( m BN/PAA) compound was firstly fabricated via in -situ polymerization, performed to obtain the m BN/PAA electrospun fibers by electrospinning technology, finally to fabricate the dielectric thermally conductive m BN/polyimide ( m BN/PI) composites via thermal-imidization followed by hot press method. The obtained m BN/PI composite with 30 wt% m BN presents relatively highly thermally conductive coefficient ( λ ), excellent dielectric constant ( e ) & dielectric loss tangent (tan δ ), and extremely outstanding thermal stability, λ of 0.696 W/m K, e of 3.77, tan δ of 0.007, T Heat-resistance index ( T HRI ) of 279 °C and glass transition temperature ( T g ) of 240 °C, which presents a great potential for packaging in integration and miniaturization of microelectronic devices. |
| Databáze: | OpenAIRE |
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