A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities
| Autor: | Yves Martin, Nicolas Boyer, Shotaro Takenobu, Yurii A. Vlasov, Ted Lichoulas, Paul Fortier, Tymon Barwicz, Hidetoshi Numata, Marwan H. Khater, Alexander Janta-Polczynski, Jae-Woong Nah, Robert K. Leidy, Eddie Kimbrell, Swetha Kamlapurkar, Sebastian Engelmann, Yoichi Taira |
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| Rok vydání: | 2016 |
| Předmět: |
Silicon photonics
business.industry Computer science Electrical engineering 02 engineering and technology Chip Atomic and Molecular Physics and Optics 020210 optoelectronics & photonics Interfacing Scalability Hardware_INTEGRATEDCIRCUITS 0202 electrical engineering electronic engineering information engineering Electronic engineering Microelectronics SMT placement equipment Electrical and Electronic Engineering Photonics business Throughput (business) |
| Zdroj: | IEEE Journal of Selected Topics in Quantum Electronics. 22:455-466 |
| ISSN: | 1558-4542 1077-260X |
| Popis: | Silicon photonics leverages microelectronic fabrication facilities to achieve photonic circuits of unprecedented complexity and cost efficiency. This efficiency does not yet translate to optical packaging, however, which has not evolved substantially from legacy devices. To reach the potential of silicon photonics, we argue that disruptive advances in the packaging cost, scalability in the optical port count, and scalability in the manufacturing volume are required. To attain these, we establish a novel photonic packaging direction based on leveraging existing microelectronics packaging facilities. We demonstrate two approaches to fiber-to-chip interfacing and one to hybrid photonic integration involving direct flip-chip assembly of photonic dies. Self-alignment is used throughout to compensate for insufficient placement accuracy of high-throughput pick and place tools. We show a self-aligned peak transmission of –1.3 dB from standard cleaved fibers to chip and of –1.1 dB from chip to chip. The demonstrated approaches are meant to be universal by simultaneously allowing wide spectral bandwidth for coarse wavelength division multiplexing and large optical-port count. |
| Databáze: | OpenAIRE |
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