Component Model Development for Ship-Level Impact of High Temperature Superconducting Power Cables
| Autor: | Sastry Pamidi, Jacob Kephart, Jason D. Miller, Isaac Leonard, Peter Cheetham, Chul H. Kim, Juan C. Ordonez |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
010308 nuclear & particles physics
Computer science business.industry High temperature superconducting Context (language use) 01 natural sciences Automotive engineering Power (physics) Electric power system Thermal insulation Component (UML) 0103 physical sciences Systems design Power semiconductor device 010306 general physics business |
| Zdroj: | 2019 IEEE Electric Ship Technologies Symposium (ESTS). |
| DOI: | 10.1109/ests.2019.8847735 |
| Popis: | The need for ship system level models for assessing the benefits of high temperature superconducting (HTS) technology is articulated. The development of ship designs with HTS power cables using Smart Ship Systems Design (S3D) showed the need for new components such as the cable terminations that serve multiple HTS cables at the nodes. Conceptual designs of such multi-cable terminations are discussed. Results of the investigations of several alternative thermal insulation systems for HTS cables are discussed in the context of reducing the mass, size, and complexity as well as increasing the resiliency of the shipboard integrated power system. Design considerations for gaseous helium HTS power devices are discussed. |
| Databáze: | OpenAIRE |
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