Failure Analysis of IGBT Bonding Wire Based on Multi-physics Coupling

Autor:	Zhenlei Li, Jincong Wang
Rok vydání:	2022
Zdroj:	2022 IEEE 2nd International Conference on Power, Electronics and Computer Applications (ICPECA).
DOI:	10.1109/icpeca53709.2022.9719316
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::848439436d5cbb5ce1b6ef77b6003528 https://doi.org/10.1109/icpeca53709.2022.9719316 Zobrazit plný text záznamu