Thermal and thermo-mechanical behavior of silicon platform with direct lead attachment

Autor:	S.L. Broutin, F.C.J. Anigbo, M.F. Dautartas, Yiu-Huen Wong
Rok vydání:	2002
Předmět:	3D optical data storage Thermal conductivity Materials science Silicon chemistry Soldering Metallurgy Thermal Miniaturization chemistry.chemical_element Composite material Lead (electronics) Kovar
Zdroj:	1997 Proceedings 47th Electronic Components and Technology Conference.
DOI:	10.1109/ectc.1997.606331
Popis:	Miniaturization, low cost, and high performance are the trends in optical data link device packaging markets. Low cost, miniaturization, and high performance are achieved by reduction in the number of piece parts, process and assembly steps by populating the platform directly with piece parts without compromising package performance. Performance is a function of the packaging material. Maximizing the heat dissipation in the package (T/sub j//spl les/T/sub jmax/and T/sub jmin/
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::848408f61aa222f18a37da4b072b8e8d https://doi.org/10.1109/ectc.1997.606331 Zobrazit plný text záznamu