| Autor: |
Po-Tsang Huang, Yu-Rou Lin, Tang-Shuan Wang, Jin-Chern Chiou, Chuan-An Cheng, Ho-Ming Tong, Wen-Wei Shen, Kuan-Neng Chen, Chi-Tsung Chiu, Ming-Hsiang Cheng, Teng-Chieh Huang, Ching-Te Chuang, Kuo-Hua Chen, Shang-Lin Wu, Yueh-Lung Lin, Lei-Chun Chou, Wei Hwang |
| Rok vydání: |
2014 |
| Předmět: |
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| Zdroj: |
ISSCC |
| DOI: |
10.1109/isscc.2014.6757452 |
| Popis: |
Heterogeneously integrated and miniaturized neural sensing microsystems for accurately capturing and classifying signals are crucial for brain function investigation and neural prostheses realization [1]. Many neural sensing microsystems have been proposed to provide small form-factor and biocompatible properties, including stacked multichip [2, 3], microsystem with separated neural sensors [4], monolithic packaged microsystem [5] and through-silicon-via (TSV) based double-side integrated microsystem [6]. These heterogeneous biomedical devices are composed of sensors and CMOS circuits for biopotential acquisition, signal processing and transmission. However, the weak signals detected from sensors in [2-5] have to pass through a string of interconnections to the CMOS circuits by wire bonding. In view of this, TSV-based double-side integration [6] uses TSV arrays to transfer the weak signals from μ-probe arrays to CMOS circuits for reducing noises. Nevertheless, the double-side integration requires preserving large area for separate μ-probe arrays and TSV arrays, and the TSV fabrication process may induce damage on CMOS circuits. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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