| Autor: |
Jackson Chung Peng Kong, Mihai Rotaru, Bok Eng Cheah |
| Rok vydání: |
2019 |
| Předmět: |
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| Zdroj: |
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC). |
| DOI: |
10.1109/eptc47984.2019.9026674 |
| Popis: |
The near-end cross talk in high speed single ended bus configuration can have a negative effect of signal integrity. In this work a 3D trench on the reference plane is used to reduce the near-end cross talk in single ended bus. The electromagnetic principle behind the positive effects of the 3D trench ground are discussed and explained here. Also, the measurement results obtained for the fabricated test boards are presented showing a reduction of up to 40% in the near-end cross talk for the single ended bus routed above the 3D trench. Two different 3D trench designs are presented, and their advantages and limitations are discussed. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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