(Invited) Integrated Microinductors on Semiconductor Substrates for Power Supply on Chip

Autor:	S. Cian O'Mathuna, James F. Rohan, Ningning Wang, Margaret Hegarty, Anne-Marie Kelleher, Brice Jamieson, Finbarr Waldron, Joe O'Brien, Saibal Roy, Santosh Kulkarni, Declan P. Casey
Rok vydání:	2011
Předmět:	Dc resistance Aspect ratio (aeronautics) Materials science business.industry Gallium nitride Technology development Engineering physics Power (physics) chemistry.chemical_compound Semiconductor chemistry Silicon carbide business Micromagnetics
Zdroj:	ECS Transactions. 41:341-347
ISSN:	1938-6737 1938-5862
DOI:	10.1149/1.3631510
Popis:	Microinductors were fabricated using electrodeposition for integration on semiconductor substrates. The process was optimised through validated models developed to focus on efficiency and footprint. Lithographic processing was performed to microfabricate Cu coils over a magnetic core. A racetrack design was used to maximise the high frequency response, yielding high inductance density and low DC resistance. The magnetic core was subsequently closed using a magnetic thin film deposition over a dielectric deposited on the Cu coils. Homogeneous ferromagnetic alloy, Ni45Fe55 of uniform thickness over a high aspect-ratio 3D structure has been achieved. Ni45Fe55 was chosen for the fabrication of micromagnetic cores due to its relatively high saturation flux density (1.6 T), resistivity (48 mΩ cm) and anisotropy field (9.5 Oe). The rationale, design, microfabrication process and characterisation results are presented.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::840ca0c65a4d9593ab8138a7ea4d48b8 https://doi.org/10.1149/1.3631510 Zobrazit plný text záznamu