High‐resolution integration of passives using micro‐contact printing (μCP)
| Autor: | Patrick F. Fleig, Charles D. E. Lakeman |
|---|---|
| Rok vydání: | 2003 |
| Předmět: |
Engineering
Fabrication business.industry Emphasis (telecommunications) Process (computing) Nanotechnology Ranging Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials visual_art Microcontact printing Electronic component visual_art.visual_art_medium Electronic engineering Electrical and Electronic Engineering Thin film business Electronic circuit |
| Zdroj: | Microelectronics International. 20:52-55 |
| ISSN: | 1356-5362 |
| DOI: | 10.1108/13565360310455544 |
| Popis: | As the number of passive components in electronic circuits increases, new methods for fabricating passives are under development to optimize utilization of board space. In this paper, we will describe the performance capabilities of TPL's micro‐contact printing (μCP) process to fabricate near‐net‐shape structures with feature sizes ranging from 100 microns to the sub‐micron scale. Like thick film processes, this novel process is compatible with a broad materials base, making a large range of materials properties available. Unlike thick film, however, this novel process employs powder‐free inks that can be patterned with high resolution. It is anticipated that this process will enable integration of passive components that show thin film performance at thick film cost. Emphasis in this paper will be placed on processing conditions, and materials properties to demonstrate the feasibility of this process for passive device fabrication. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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