Laser Lift Off and Multi Dies Collective Bonding for Inorganic $\mu \text{LED}$ with the Newly Developed Material

Autor: Hirokazu Noma, Naoya Suzuki, Masataka Nishida, Kazutaka Honda
Rok vydání: 2021
Předmět:
Zdroj: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
DOI: 10.1109/ectc32696.2021.00302
Popis: In this work, the temporally fixing carrier for the laser lift off (LLO) and the bonding strength leveling film (BFL) was developed to improve the productivity of a series of the process, LLO, mass transfer and collective bonding of $\mu\text{LEDs}$ . The $\mu\text{LEDs}$ on the sapphire carrier went through the LLO process with the developed carrier, and temporally mounting process with prepared pickup tool to the final target substrate laminated with nonconductive film. As a results, the total yield of mass transfer was > 99%. After the transfer process, 4,465 $\mu\text{LEDs}$ in $3.3\ \text{mm}\times 2.8\ \text{mm}$ , were integrated to the substrate by collective bonding with BFL film which can apply uniform pressure and temperature among $\mu\text{LEDs}$ in the process. The cross sectional image after the bonding showed that the pad of $\mu\text{LEDs}$ and the target substrate form the uniform connect.
Databáze: OpenAIRE