Autor: |
Yasuhiro Kosasayama, Keisuke Kama, Takaki Sugino, Yasuaki Ohta, Masahiro Tsugai, Hisatoshi Hata, Takanori Ohno, Takahiro Ohnakado, Masashi Ueno, Hiroshi Fukumoto |
Rok vydání: |
2009 |
Předmět: |
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Zdroj: |
SPIE Proceedings. |
ISSN: |
0277-786X |
Popis: |
We have developed a novel readout circuit architecture realizing a TEC-less (Thermo-Electric Cooler) operation for an SOI diode uncooled infrared focal plane array (IRFPA). Through the fabrication of an SOI diode uncooled 320 x 240 IRFPA adopting the readout circuit architecture with our existing 25μm pixel-pitch technology, we demonstrate that the variation of the output DC level of the pixels is successfully suppressed in environmental temperatures from -10°C to 50°C. The developed TEC-less technology greatly enhances the ability of the SOI diode uncooled IRFPA, which inherently possesses excellent uniformity and low noise features. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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