Evaluation of intermediate phases formed on the bonding interface of hot pressed Cu/Al clad materials

Autor: Dong-Su Bae, Yong-Bae Kim, Geun-An Lee, Kwang Seok Lee, Sang-Pill Lee, Sang-Mok Lee, Jongsup Lee
Rok vydání: 2016
Předmět:
Zdroj: Metals and Materials International. 22:849-855
ISSN: 2005-4149
1598-9623
DOI: 10.1007/s12540-016-6245-9
Popis: The aim of the present study is to identify the properties of intermediate phases formed on the bonding interface of hot pressed Cu/Al clad materials by transmission electron microscopy and nano-indentation analyses. Cu/Al clad materials were fabricated by hot pressing under 200 MPa at 250 °C for 1 h and then heat treated at 400 °C for 1 h. Nano-indentation measurement was conducted to evaluate the nanohardness and modulus of the intermediate phases formed between the Cu/Al interfaces. A 3-tier diffusion layer was observed at the Cu/Al interfaces. Knoop microhardness values at the bonding interface were 7 to 11 times that of the Cu and Al matrix metals. The intermediate phases formed at the bonding interface were Al4Cu9, AlCu, and Al2Cu. A mapping analysis confirmed that the Al and Cu particles moved via mutual diffusion toward the intermediate phases formed at the bonding interface. The nanohardness values of η2-AlCu and γ1-Al4Cu9 were 4 to 7 times that of the Cu and Al matrix metals. Nanohardness and Knoop microhardness measurement curves exhibited similar tendencies. The rigidity values of the respective intermediate phases can be arranged in descending order as follows: γ1-Al4Cu9 > η2-AlCu > θ-Al2Cu.
Databáze: OpenAIRE
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