New Developments in Reel-To-Reel plating of Connectors

Autor:	Uwe Landau
Rok vydání:	2003
Předmět:	Engineering drawing Engineering business.industry Metals and Alloys Surfaces and Interfaces Condensed Matter Physics Surfaces Coatings and Films Cost reduction Cable gland Mechanics of Materials Plating Reel-to-reel audio tape recording Electronics Electroplating business Process engineering
Zdroj:	Transactions of the IMF. 81:B51-B54
ISSN:	1745-9192 0020-2967
Popis:	SUMMARYThe development of the electronics industry shows some prevailing trends that have consequences also for surface technology eg. miniaturisation, cost reduction and environmental needs. Thus, for electroplating of connectors sufficient answers have also to be found to meet these challenges. Selective 3-D connector plating, use of electrolytic nickel-phosphorus (NiPhosConx) barrier layer instead of electrolytic nickel and SPINJEV-selective masking technique are shown to be efficient for reel-to-reel plating, especially to meet cost reduction needs.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::81eacbdec008f88fbcb3ae82c5cc8bcc https://doi.org/10.1080/00202967.2003.11871498 Zobrazit plný text záznamu