Etching submicrometer trenches by using the Bosch process and its application to the fabrication of antireflection structures
| Autor: | Chienliu Chang, Kuang-Chong Wu, Masayoshi Esashi, Yeong-Feng Wang, Chih-Kung Lee, Yusuke Kawai, Yoshiaki Kanamori, Ji Jheng Shih |
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| Rok vydání: | 2005 |
| Předmět: |
Fabrication
Chemistry Mechanical Engineering Process (computing) Nanotechnology Surface finish Electronic Optical and Magnetic Materials Mechanics of Materials Etching (microfabrication) Deep reactive-ion etching Sidewall roughness Electrical and Electronic Engineering Inductively coupled plasma Reactive-ion etching |
| Zdroj: | Journal of Micromechanics and Microengineering. 15:580-585 |
| ISSN: | 1361-6439 0960-1317 |
| DOI: | 10.1088/0960-1317/15/3/020 |
| Popis: | This paper reports solutions to the issues of profile control, microloading effect and suppression of the sidewall roughness of submicrometer trenches by modifying the regular conditions of the Bosch process that is often employed in the inductively coupled plasma (ICP) deep reactive ion etching (DRIE) system. Additionally, under the modified processing conditions, a high efficient antireflection structure can be fabricated. |
| Databáze: | OpenAIRE |
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