60 GHz Broadband MS-to-CPW Hot-Via Flip Chip Interconnects

Autor:	Herbert Zirath, Wei-Cheng Wu, Camilla Kärnfelt, Li-Han Hsu, J.P. Starski, Yun-Chi Wu, Edward Yi Chang
Rok vydání:	2007
Předmět:	Engineering business.industry Integrated circuit Condensed Matter Physics Microstrip law.invention Chip-scale package law Broadband Electronic engineering Return loss Insertion loss Radio frequency Electrical and Electronic Engineering business Flip chip
Zdroj:	IEEE Microwave and Wireless Components Letters. 17:784-786
ISSN:	1558-1764 1531-1309
Popis:	In this letter, the microstrip-to-coplanar waveguide (MS-to-CPW) hot-via flip chip interconnect has been experimentally demonstrated to have broadband performance from dc to 67 GHz. The interconnect structures with the hot-via transitions were first designed and optimized by using the electromagnetic simulation tool. Three types of designs were investigated in this letter. The interconnect structures were then fabricated and radio frequency (RF) tested up to 67GHz. The optimized interconnect structure with the compensation design demonstrated excellent RF characteristics with the insertion loss less than 0.5dB and the return loss below 18dB over a very broad bandwidth from dc to 67GHz. This is to our knowledge the best result reported for this frequency range.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::81ca6b7e3a94b6c6f2464651812bc70d https://doi.org/10.1109/lmwc.2007.908053 Zobrazit plný text záznamu