Plasma model for charging damage

Autor: M.C. Vella, Michael I. Current, Nicholas H. Tripsas, W. Lukaszek
Rok vydání: 1995
Předmět:
Zdroj: Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 96:48-51
ISSN: 0168-583X
DOI: 10.1016/0168-583x(94)00452-8
Popis: The mechanism responsible for charging damage to integrated circuit device insulators is treated as a plasma phenomenon, in which the beam/plasma drives potential differences on the process surface. J−V data obtained with the CHARM2 diagnostic in a high current implanter (flood OFF) are fit with a plasma probe model. The fit indicates plasma buildup over the wafer surface. A cold plasma flood is suggested as a means of limiting potential differences during ion implantation.
Databáze: OpenAIRE