Effect of Nitrogen Content on Physical and Chemical Properties of TiN Thin Films Prepared by DC Magnetron Sputtering with Supported Discharge
Autor: | K. R. Gunasekhar, A. Kavitha, R. Kannan, S. Rajashabala |
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Rok vydání: | 2017 |
Předmět: |
010302 applied physics
Materials science Analytical chemistry chemistry.chemical_element 02 engineering and technology Partial pressure Sputter deposition equipment and supplies 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Titanium nitride Electronic Optical and Magnetic Materials Amorphous solid chemistry.chemical_compound chemistry Sputtering 0103 physical sciences Materials Chemistry Electrical and Electronic Engineering Total pressure Thin film 0210 nano-technology Tin |
Zdroj: | Journal of Electronic Materials. 46:5773-5780 |
ISSN: | 1543-186X 0361-5235 |
DOI: | 10.1007/s11664-017-5608-4 |
Popis: | Amorphous titanium nitride (TiN) thin films have been prepared on silicon (Si) and glass substrates by direct-current (DC) reactive magnetron sputtering with a supported discharge (triode). Nitrogen gas (N2) at partial pressure of 0.3 Pa, 0.4 Pa, 0.5 Pa, and 0.6 Pa was used to prepare the TiN thin films, maintaining total pressure of argon and N2 of about 0.7 Pa. The chemical, microstructural, optical, and electrical properties of the TiN thin films were systematically studied. Presence of different phases of Ti with nitrogen (N), oxygen (O2), and carbon (C) elements was revealed by x-ray photoelectron spectroscopy characterization. Increase in the nitrogen pressure from 0.3 Pa to 0.6 Pa reduced the optical bandgap of the TiN thin film from 2.9 eV to 2.7 eV. Photoluminescence study showed that TiN thin film deposited at N2 partial pressure of 0.3 Pa exhibited three shoulder peaks at 330 nm, 335 nm, and 340 nm, which disappeared when the sample was deposited with N2 partial pressure of 0.6 Pa. Increase in the nitrogen content decreased the electrical resistivity of the TiN thin film from 3200 μΩ cm to 1800 μΩ cm. Atomic force microscopy studies of the TiN thin films deposited with N2 partial pressure of 0.6 Pa showed a uniform surface pattern associated with accumulation of fine grains. The results and advantages of this method of preparing TiN thin films are also reported. |
Databáze: | OpenAIRE |
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